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It analyzed several key factors by system dynamics that the task decomposition in emergency logistics impact on dynamic alliance of logistics. These factors included inter-constraints, quality of cooperation, collaboration time, a...
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It analyzed several key factors by system dynamics that the task decomposition in emergency logistics impact on dynamic alliance of logistics. These factors included inter-constraints, quality of cooperation, collaboration time, ability to adapt with each other, core capabilities of logistics. To establish diagram and system dynamics model, it can forecast and analysis disadvantages of task decomposition in emergency logistics. It can for the government emergency management to provide strategic adjustment decision support. On this basis, it simulated the task decomposition of system dynamics model on dynamic alliance of logistics by EXCEL, tested and verified this way was a feasible approach.
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摘要 :
Zr55Ni5Al10Cu30 alloy which has fine glass-forming ability has been used as material. The molten alloy was treated with electric pulse for 30s and the frequency of 2Hz. The samples were measured by metallographic analysis and Diff...
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Zr55Ni5Al10Cu30 alloy which has fine glass-forming ability has been used as material. The molten alloy was treated with electric pulse for 30s and the frequency of 2Hz. The samples were measured by metallographic analysis and Differential Scanning Calorimeter (DSC) to investigate the modification effect. The results show that the solidification structure of the alloy with low cooling speed was changed clearly after electric pulse modification. It is found the samples with high cooling speed treated have different glass-forming ability and characteristic temperature compared with the untreated.
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The dynamic mechanical properties of Sn-Ag lead-free solders have been studied by means of a split Hopkinson pressure bar (SHPB) at various strain rates. Tests were conducted at room temperature and under uniaxial compressive cond...
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The dynamic mechanical properties of Sn-Ag lead-free solders have been studied by means of a split Hopkinson pressure bar (SHPB) at various strain rates. Tests were conducted at room temperature and under uniaxial compressive conditions. It is shown that the Sn-Ag lead-free solders are viscoplastic materials, which are sensitive to the strain rate at higher strain rate. It is found that the materials' dynamic yield stress largely falls into a linear relation to the strain rate in logarithm scales. Phenomenological dynamic constitutive equation was then established following Cowper-Symonds model. The dynamic mechanical prosperities and effects of strain-rate of lead-free solder discussed explain that Sn-Ag solder is attractive to the electronic industry.
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摘要 :
The dynamic mechanical properties of Sn-Ag lead-free solders have been studied by means of a split Hopkinson pressure bar (SHPB) at various strain rates. Tests were conducted at room temperature and under uniaxial compressive cond...
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The dynamic mechanical properties of Sn-Ag lead-free solders have been studied by means of a split Hopkinson pressure bar (SHPB) at various strain rates. Tests were conducted at room temperature and under uniaxial compressive conditions. It is shown that the Sn-Ag lead-free solders are viscoplastic materials, which are sensitive to the strain rate at higher strain rate. It is found that the materials' dynamic yield stress largely falls into a linear relation to the strain rate in logarithm scales. Phenomenological dynamic constitutive equation was then established following Cowper-Symonds model. The dynamic mechanical prosperities and effects of strain-rate of lead-free solder discussed explain that Sn-Ag solder is attractive to the electronic industry.
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摘要 :
The effect of electric pulse modification on pure Zinc is studied by the analysis of the cooling curve under certain condition of electric pulse treating factors. The results show that the degree of nucleating undercooling is incr...
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The effect of electric pulse modification on pure Zinc is studied by the analysis of the cooling curve under certain condition of electric pulse treating factors. The results show that the degree of nucleating undercooling is increasing from 6.49℃to 14.24℃ and the degree of growing undercooling is reduc ing from 26.5℃ to 21.95℃.The platform temperature is sharply increased. The time of nucleation and solidification are all reduced.
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